Browsing by Subject Copper

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Showing results 1 to 14 of 14
Issue DateTitleAuthor(s)
27-Feb-2017A benzimidazole-based single molecular multianalyte fluorescent probe for the simultaneous analysis of Cu2+ and Fe3+Lee, D.Y.; Singh, N.; Jang, D.O.
11-Dec-2019Benzothiazole-based heterodipodal chemosensor for CU2+ and CN– ions in aqueous mediaNa, W.S.; Raj, P.; Singh, N.; Jang, D.O.
19-Jul-2021A benzothiazole-based receptor for colorimetric detection of Cu2+ and S2 ions in aqueous mediaPark, S. M.; Saini, S.; Park, J. E.; Singh, N.; Jang, D. O.
23-Aug-2016Colorimetric Detection of Spermine by the CuII Complex of Imine-Based Organic Nanoaggregates in Aqueous MediumChopra, S.; Singh, J.; Kaur, H.; Singh, A.; Singh, N.; Kaur, N.
7-Dec-2021Design, modeling and analysis of Cu-Carbon hybrid interconnectsKumari, B.; Kumar, R.; Sharma, R.; Sahoo, M.
16-Jun-2021Effect of electroplated interlayers on bonding mechanism of cold-sprayed copper on SS316L steel substrateSingh, S.; Singh, H.
22-Aug-2019Effect of electroplated interlayers on properties of cold-sprayed copper coatings on SS316L steelSingh, S.; Chaudhary, S.; Singh, H.
17-Dec-2020Effect of substrate surface roughness on properties of cold-sprayed copper coatings on SS316L steelSingh, S.; Singh, H.; Chaudhary, S.; Buddu, R.K.
29-Dec-2018Rationally 3D-textured copper surfaces for laplace pressure imbalance-induced enhancement in dropwise condensationSharma, C.S.; Stamatopoulos, C.; Suter, R.; Rohr, P.R.; Poulikakos, D.
24-Jun-2021Role of grain Size on the effective resistivity of Cu-Graphene hybrid interconnectsKumar, R.; Pathania, S.; Guglani, S.; Kumar, A.; Kumar, S.; Roy, S.; Kaushik, B. K.; Sharma, R.
28-Dec-2018Single chemosensor for sensing multiple analytes: selective fluorogenic detection of Cu2+ and BrKo, Y.G.; Mayank; Singh, N.; Jang, D.O.
18-Jun-2021Synthesis and transfer of large area graphene without support layerGhai, V.; Singh, H.; Agnihotri, P. K.
18-Jun-2021Temperature and dielectric surface roughness dependent performance analysis of cu-graphene hybrid interconnectsKumar, R.; Kumari, B.; Kumar, S.; Sahoo, M.; Sharma, R.
29-Jun-2021Temperature-Aware compact modeling for resistivity in Ultra-Scaled Cu-Graphene hybrid interconnectsKumar, R.; Kumar, S.; Guglani, S.; Roy, S.; Kaushik, B. K.; Sharma, R.; Achar, R.