| Issue Date | Title | Author(s) |
| 24-Nov-2016 | Airgap interconnects: Modeling, optimization, and benchmarking for backplane, PCB, and interposer applications | Kumar, V.; Sharma, R.; Uzunlar, E.; Zheng, L.; Bashirullah, R.; Kohl, P.; Bakir, M.S.; Naeemi, A. |
| 24-Jun-2022 | A brute force methodology for automated data extraction and analysis for Finite Element Analysis | Kumar, V.; Balendra; Sahani, A. |
| 28-Nov-2016 | Design and fabrication of ultra low-loss, high-performance 3D chip-chip air-clad interconnect pathway | Uzunlar, E.; Sharma, R.; Saha, R.; Kumar, V.; Bashirullah, R.; Naeemi, A.; Kohl, P.A. |
| 27-Oct-2021 | A framework for effective and clean conversion of machining waste into metal powder feedstock for additive manufacturing | Dhiman, S.; Joshi, R. S.; Singh, S.; Gill, S. S.; Singh, H.; Kumar, R.; Kumar, V. |
| 21-Nov-2022 | Frequency aware face hallucination generative adversarial network with semantic structural constraint | Sharma, S.; Dhall, A.; Kumar, V. |
| 26-Aug-2022 | A low-cost ambu-bag based ventilator for Covid-19 pandemic | Kumar, M.; Kumar, R.; Kumar, V.; Chander, A.; Gupta, V.; Sahani, A.K. |
| 12-Aug-2021 | Multiphysics approach using computational fluid dynamics for signal integrity analysis in high speed serial links | Pathania, S.; Vasa, M.; Shrivastava, A.; Kumar, S.; Kumar, V.; Muthusamy, S.; Seema, P.K.; Mutnury, B.; Sharma, R. |
| 28-Jun-2022 | Recent advances in low-cost, portable automated resuscitator systems to fight COVID-19 | Kumar, V.; Kumar, R.; Kumar, M.; Wander, G.S.; Gupta, V.; Sahani, A. |
| 21-Jul-2022 | Recycling of Ti6Al4V machining swarf into additive manufacturing feedstock powder to realise sustainable recycling goals | Dhiman, S.; Joshi, R.S.; Singh, S.; Gill, S.S.; Singh, H.; Kumar, R.; Kumar, V. |
| 18-Nov-2022 | Ruthenium(II) dimethyl sulphoxide based complexes: A potent inducer of apoptosis | Khatkar, S.; Dubey, S.K.; Saraf, P.; Bhardwaj, J.K.; Kumar, S.; Kumar, V.; Singh, G.; Shayoraj |
| 15-Nov-2021 | Temporal-spatial-energy resolved advance multidimensional techniques to probe photovoltaic materials from atomistic viewpoint for next-generation energy solutions | Kumar, V.; Nisika; Kumar, M. |
| 22-Jun-2021 | Thermal sensitivity of dielectric materials in High-Speed designs | Pathania, S.; Mutnury, B.; Vasa, M.; Kumar, V.; Muthusamy, S.; Seema, P. K.; Sharma, R. |
