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| Issue Date | Title | Author(s) |
|---|---|---|
| 3-Sep-2022 | The IEEE EPS packaging benchmark suite | Guo, F.; Aygun, K.; Dale Becker, W.; Talocia, S.G.; Hejase, J.A.; Wong, W.-W.; Zhou, T.; Barnes, H.; Peng, Z.; Pelger, A.; Sahouli, M.; Schutt-Aine, J.; Ling, F.; Griese, E.; Paladhi, P.R.; Sharma, R.; Pham, N.; Winkel, T.-M.; Fledell, E.; Hill, M.J.; Silva, B.; Hu, K.; Aronsson, J.; Liu, C.; Jeong, Y.; Yilmaz, A.E. |