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Browsing by Author Telescu, M.
Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
11-Dec-2019 | Foreword: special section on packaging and interconnects: cutting-edge solutions in modeling, design, and characterization—part I | Telescu, M.; Gu, X.; Sharma, R. |
11-Dec-2019 | Foreword: special section on packaging and Interconnects: cutting-edge solutions in modeling, design, and characterization—Part II | Telescu, M.; Gu, X.; Sharma, R. |