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http://dspace.iitrpr.ac.in:8080/xmlui/handle/123456789/1417Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Telescu, M. | - |
| dc.contributor.author | Gu, X. | - |
| dc.contributor.author | Sharma, R. | - |
| dc.date.accessioned | 2019-12-11T15:39:28Z | - |
| dc.date.available | 2019-12-11T15:39:28Z | - |
| dc.date.issued | 2019-12-11 | - |
| dc.identifier.uri | http://localhost:8080/xmlui/handle/123456789/1417 | - |
| dc.language.iso | en_US | en_US |
| dc.title | Foreword: special section on packaging and Interconnects: cutting-edge solutions in modeling, design, and characterization—Part II | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | Year-2019 | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Full Text.pdf | 702.7 kB | Adobe PDF | View/Open Request a copy |
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