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Issue Date
Title
Author(s)
20-Jun-2021
A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of Copper– Graphene hybrid On-Chip interconnects
Kumar, R.
;
Kumar, A.
;
Guglani, S.
;
Kumar, S.
;
Roy, S.
;
Kaushik, B. K.
;
Sharma, R.
;
Achar, R.
24-Jun-2021
Role of grain Size on the effective resistivity of Cu-Graphene hybrid interconnects
Kumar, R.
;
Pathania, S.
;
Guglani, S.
;
Kumar, A.
;
Kumar, S.
;
Roy, S.
;
Kaushik, B. K.
;
Sharma, R.
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Author
2
Kumar, R.
2
Kumar, S.
2
Roy, S.
2
Sharma, R.
1
Achar, R.
1
Pathania, S.
Subject
1
Copper
1
Copper–graphene
1
grain size
1
graphene
1
high-speed interconnects
1
interconnects
1
matrix rational approximation (MRA)
1
reliability analysis
1
resistivity
1
signal integrity
.
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Date issued
2
2021