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Issue DateTitleAuthor(s)
8-Jun-2021Thermoelectric properties of half heusler topological semi-metal liAuTeYadav, A.; Kumar, S.; Muruganathan, M.; Kumar, R.
16-Jun-2021Revised lifetime of the 11/2 − state in 45Sc via coulomb excitation∗Minda, M. M.; Napiorkowski, P. J.; Kumar, R.; Saxena, M.; Dutt, S; Agarwal, A.; Ahmed, I.; Bhattacharya, S.; Jhingan, A.; Kaur, J.; Habior, M. K.; Kumar, M.; Kumar, S.; Kumar, D.; Nanal, V.; Palit, R.; Rai, N. K.; Shuaib, M.; Sood, A.; Stolarz, A.; Trivedi, T.; Tyagi, A. K.; Bhowmik, R. K.; Wollersheim, H. J.
18-Jun-2021Temperature and dielectric surface roughness dependent performance analysis of cu-graphene hybrid interconnectsKumar, R.; Kumari, B.; Kumar, S.; Sahoo, M.; Sharma, R.
18-Jun-20212D- Discrete cosine transform based dynamically controllable image compression techniqueKumar, Y. S.; Kumar, R.; Kumar, S.
20-Jun-2021A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of Copper– Graphene hybrid On-Chip interconnectsKumar, R.; Kumar, A.; Guglani, S.; Kumar, S.; Roy, S.; Kaushik, B. K.; Sharma, R.; Achar, R.
20-Jun-2021Estimating per-unit-length resistance parameter in emerging Copper-Graphene hybrid interconnects via prior knowledge based accelerated neural networksKumar, R.; Narayan, S. S. L.; Kumar, S.; Roy, S.; Kaushik, B. K.; Achar, R.; Sharma, R.
24-Jun-2021Role of grain Size on the effective resistivity of Cu-Graphene hybrid interconnectsKumar, R.; Pathania, S.; Guglani, S.; Kumar, A.; Kumar, S.; Roy, S.; Kaushik, B. K.; Sharma, R.
29-Jun-2021Temperature-Aware compact modeling for resistivity in Ultra-Scaled Cu-Graphene hybrid interconnectsKumar, R.; Kumar, S.; Guglani, S.; Roy, S.; Kaushik, B. K.; Sharma, R.; Achar, R.