Please use this identifier to cite or link to this item: http://dspace.iitrpr.ac.in:8080/xmlui/handle/123456789/1846
Title: Temperature and dielectric surface roughness dependent performance analysis of cu-graphene hybrid interconnects
Authors: Kumar, R.
Kumari, B.
Kumar, S.
Sahoo, M.
Sharma, R.
Keywords: Copper
Interconnects
Hybrid
Temperature
Roughness
Delay
Crosstalk
Issue Date: 18-Jun-2021
Abstract: To exploit the superior performance of copper and graphene interconnects, hybrid interconnects are seen as a promising interconnect technology for future technology nodes. Dielectric surface roughness is a process induced phenomenon that affects the performance of the interconnects. This paper presents an in-depth investigation on the impact of temperature and dielectric surface roughness on performance parameters of Cu-Graphene hybrid interconnects.
URI: http://localhost:8080/xmlui/handle/123456789/1846
Appears in Collections:Year-2020

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