Please use this identifier to cite or link to this item: http://dspace.iitrpr.ac.in:8080/xmlui/handle/123456789/1883
Title: A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of Copper– Graphene hybrid On-Chip interconnects
Authors: Kumar, R.
Kumar, A.
Guglani, S.
Kumar, S.
Roy, S.
Kaushik, B. K.
Sharma, R.
Achar, R.
Keywords: Copper–graphene
high-speed interconnects
matrix rational approximation (MRA)
reliability analysis
signal integrity
transient response
Issue Date: 20-Jun-2021
Abstract: In this article, a closed-form matrix rational approximation (MRA) model is presented for the reliability assessment of copper–graphene hybrid on-chip interconnect networks. The key feature of this MRA model is its capacity to predict how the different values of temperature and dielectric roughness affect the signal integrity performance of the hybrid interconnect networks. As a result, the proposed MRA model is well suited for very fast parametric sweeps and worst case analysis of the hybrid interconnect networks, which has not been possible using existing closed-form models or even SPICE simulations. Numerical examples show that the proposed model is significantly more efficient than conventional models while exhibiting error less than 5%.
URI: http://localhost:8080/xmlui/handle/123456789/1883
Appears in Collections:Year-2020

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