Please use this identifier to cite or link to this item: http://dspace.iitrpr.ac.in:8080/xmlui/handle/123456789/354
Full metadata record
DC FieldValueLanguage
dc.contributor.authorNishad, A.K.
dc.contributor.authorSharma, R.
dc.date.accessioned2016-11-16T09:25:06Z
dc.date.available2016-11-16T09:25:06Z
dc.date.issued2016-11-16
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/354
dc.description.abstractIn this paper, we report the performance improvement obtained in side-contact multilayer Graphene nanoribbon (SC-MLGNR) interconnects by using intercalated AsF5. We compare it with that of traditional Cu interconnects as well as undoped (or neutral) SC-MLGNRs for both local/intermediate and global interconnect applications, at 6 nm technology node. We present a qualitative analysis of the effect of intercalation doping on the equivalent circuit parameters of SC-MLGNRs using a driver-load interconnect equivalent circuit. For our analysis, we have considered three interconnect performance metrics: delay, energy-delay product (EDP), and bandwidth density (BWD). We observe that for global interconnects of length 1000 μm the EDP of optimized AsF5-intercalated SC-MLGNRs reduces by 50% while its BWD increases by 1.9× when compared to Cu. Similarly, for interconnect lengths of 500 μm (local/intermediate level interconnects), improvement in EDP and BWD has been 60.13% and 2.4×, respectively as compared to Cu. In our analysis, interconnect thickness is optimized to obtain the lowest delay and EDP along with the highest bandwidth density for both local/intermediate and global interconnects.en_US
dc.language.isoen_USen_US
dc.subjectBandwidthen_US
dc.subjectElectric network analysisen_US
dc.subjectEquivalent circuitsen_US
dc.subjectGrapheneen_US
dc.subjectMultilayersen_US
dc.subjectNanoribbonsen_US
dc.subjectNetwork components Energy delay producten_US
dc.subjectEquivalent circuit parameteren_US
dc.subjectGraphene nanoribbonsen_US
dc.subjectInterconnect performanceen_US
dc.subjectInterconnect thicknessen_US
dc.subjectOn-chip interconnectsen_US
dc.subjectPerformance improvementen_US
dc.subjectSpeedupen_US
dc.subjectIntegrated circuit interconnectsen_US
dc.titlePerformance improvement in side contact multilayer graphene nanoribbon interconnects using intercalated dopingen_US
dc.typeArticleen_US
Appears in Collections:Year-2016

Files in This Item:
File Description SizeFormat 
Full Text.pdf268.17 kBAdobe PDFView/Open    Request a copy


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.