Please use this identifier to cite or link to this item: http://dspace.iitrpr.ac.in:8080/xmlui/handle/123456789/3658
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dc.contributor.authorNandi, S.K.
dc.contributor.authorAgrawal, A.
dc.contributor.authorKumar, r
dc.date.accessioned2022-07-16T20:12:22Z
dc.date.available2022-07-16T20:12:22Z
dc.date.issued2022-07-17
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/3658
dc.description.abstractSelective laser melting (SLM) has recently gained momentum as a state-of-the-art manufacturing process capable of building highly customized products. Localized heat input and short interaction time of laser beam intensify thermal gradient and deteriorate the part's quality due to thermal stresses and uncontrolled distortions. An algorithm is proposed that comprises of analytical solution for volumetric moving heat source combined with numerically formulated conduction and convection cooling to estimate the temperature distribution and melt-pool geometry during the SLM process. Fully implicit finite volume equations are framed with appropriate part boundary conditions for the two-dimensional domain and iteratively solved by Alternating Direction Implicit (ADI) method. The proposed methodology has shown the potential to develop a deep understanding of this dynamic process and deliver results at low computational costs. Simulations for single-track melting have been studied by changing the process parameters, and phase change from powder to solid is well exhibited by adopting temperature-dependent material properties. The proposed model has been validated by experimental data from the literature for two alloys - Inconel 718 and SS316L.en_US
dc.language.isoen_USen_US
dc.subjectAlternating direction impliciten_US
dc.subjectFinite volume methoden_US
dc.subjectSelective laser meltingen_US
dc.subjectSemi-analytical modelen_US
dc.subjectThermal modellingen_US
dc.titleComputationally inexpensive semi-analytical thermal model to predict melt-pool dimensions for a single-track in selective laser meltingen_US
dc.typeArticleen_US
Appears in Collections:Year-2022

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