The IEEE EPS packaging benchmark suite

Abstract

The current state of the Packaging Benchmark Suite being developed by the IEEE EPS technical committee on electrical design, modeling, and simulation (TC-EDMS) is reviewed. The history and goals of the effort to establish the Suite, the key requirements from benchmarks that can support advances in simulation tools and computational methods, and the process being followed by the volunteer committee formed by the authors to produce the Suite are described. The first three benchmarks in the Suite and the steps that were taken to elevate them from potential candidates to effective benchmarks are presented.