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Results 1-10 of 33 (Search time: 0.002 seconds).
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Issue DateTitleAuthor(s)
13-Jun-2021First principle analysis of os-passivated armchair graphene nanoribbons for nanoscale interconnectsNishad, V. K.; Nishad, A. K.; Kaushik, B. K.; Sharma, R.
18-Jun-2021Temperature and dielectric surface roughness dependent performance analysis of cu-graphene hybrid interconnectsKumar, R.; Kumari, B.; Kumar, S.; Sahoo, M.; Sharma, R.
20-Jun-2021A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of Copper– Graphene hybrid On-Chip interconnectsKumar, R.; Kumar, A.; Guglani, S.; Kumar, S.; Roy, S.; Kaushik, B. K.; Sharma, R.; Achar, R.
20-Jun-2021Estimating per-unit-length resistance parameter in emerging Copper-Graphene hybrid interconnects via prior knowledge based accelerated neural networksKumar, R.; Narayan, S. S. L.; Kumar, S.; Roy, S.; Kaushik, B. K.; Achar, R.; Sharma, R.
22-Jun-2021Thermal sensitivity of dielectric materials in High-Speed designsPathania, S.; Mutnury, B.; Vasa, M.; Kumar, V.; Muthusamy, S.; Seema, P. K.; Sharma, R.
24-Jun-2021First principle analysis of Li-Doped armchair graphene nanoribbons for nanoscale metal interconnect applicationsNishad, V. K.; Sharma, R.
24-Jun-2021Role of grain Size on the effective resistivity of Cu-Graphene hybrid interconnectsKumar, R.; Pathania, S.; Guglani, S.; Kumar, A.; Kumar, S.; Roy, S.; Kaushik, B. K.; Sharma, R.
29-Jun-2021Temperature-Aware compact modeling for resistivity in Ultra-Scaled Cu-Graphene hybrid interconnectsKumar, R.; Kumar, S.; Guglani, S.; Roy, S.; Kaushik, B. K.; Sharma, R.; Achar, R.
1-Aug-2021First-principle analysis of transition metal edge-passivated armchair graphene nanoribbons for nanoscale interconnectsNishad, V. K.; Nishad, A. K.; Kaushik, B. K.; Sharma, R.
12-Aug-2021Multiphysics approach using computational fluid dynamics for signal integrity analysis in high speed serial linksPathania, S.; Vasa, M.; Shrivastava, A.; Kumar, S.; Kumar, V.; Muthusamy, S.; Seema, P.K.; Mutnury, B.; Sharma, R.

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