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Results 1-7 of 7 (Search time: 0.003 seconds).
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Issue Date
Title
Author(s)
5-Dec-2019
Analyzing crosstalk-induced effects in rough on-chip copper interconnects
Pathania, S.
;
Kumar, S.
;
Sharma, R.
13-Nov-2018
Investigating the role of sidewall surface roughness on the performance of through silicon vias
Kumar, S.
;
Pathania, S.
;
Sharma, R.
19-Mar-2020
Crosstalk analysis for rough copper interconnects considering ternary logic
Pathania, S.
;
Kumar, S.
;
Sharma, R.
22-Jun-2021
Thermal sensitivity of dielectric materials in High-Speed designs
Pathania, S.
;
Mutnury, B.
;
Vasa, M.
;
Kumar, V.
;
Muthusamy, S.
;
Seema, P. K.
;
Sharma, R.
24-Jun-2021
Role of grain Size on the effective resistivity of Cu-Graphene hybrid interconnects
Kumar, R.
;
Pathania, S.
;
Guglani, S.
;
Kumar, A.
;
Kumar, S.
;
Roy, S.
;
Kaushik, B. K.
;
Sharma, R.
12-Aug-2021
Multiphysics approach using computational fluid dynamics for signal integrity analysis in high speed serial links
Pathania, S.
;
Vasa, M.
;
Shrivastava, A.
;
Kumar, S.
;
Kumar, V.
;
Muthusamy, S.
;
Seema, P.K.
;
Mutnury, B.
;
Sharma, R.
19-Aug-2021
Thermal impact on high speed PCB interconnects
Pathania, S.
;
Vasa, M.
;
Mutnury, B.
;
Sharma, R.
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Author
5
Kumar, S.
3
Mutnury, B.
3
Vasa, M.
2
Kumar, V.
2
Muthusamy, S.
1
Guglani, S.
1
Kaushik, B. K.
1
Kumar, A.
1
Kumar, R.
1
Roy, S.
.
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Subject
2
Global interconnects
2
PCB
2
Repeaters
2
Surface roughness
2
Thermal sensitivity
1
Bandwidth density (BWD)
1
CFD
1
Co-analysis
1
Copper
1
Crosstal
.
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Date issued
4
2021
1
2020
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2019
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2018