• Simulation-based impedance characterization of PDN in high-performance multi-chip HTCC packages for avionics 

  Dang, A.; Jilla, S.P.; Kumar, K.; Singh, G.; Sharma, R.; Mukerji, A. (2020-03-19)

  High-Speed Multi-Chip HTCC Packages for Avionics require careful considerations early in the design cycle to obtain the optimum electrical performance. Some design goals can be achieved with simple stackup or ...
• Crosstalk analysis for rough copper interconnects considering ternary logic 

  Pathania, S.; Kumar, S.; Sharma, R. (2020-03-19)

  In this paper, crosstalk induced effects in a 3-line bus architecture for global interconnects has been investigated. The dimensions of global level Copper (Cu) interconnects at 22nm technology node are taken as per ...
• Structural components of low density polyethylene and their role in conduction 

  Upadhyay, A.K.; Reddy, C.C. (2020-03-19)

  Low density polyethylene (LDPE), a promising member of polyethylene dielectric family, majorly used in high voltage direct current (HVDC) cables. Even with their associated advantages of excellent quality of insulation, ...
• Performance analysis of FFR based non orthogonal spectrum shared SIMO systems 

  Saluja, D.; Kher, V.; Kumar, P.; Kumar, S. (2020-03-19)

  Spectrum sharing has been considered as a most promising solution to improve the spectrum efficiency of nextgeneration wireless networks. In particular, non orthogonal spectrum sharing allows the m ultiple operators to ...
• Experimental investigations on remote measurement of HV electrode current 

  Singh, A.; Singh, B.; Reddy, C.C. (2020-03-19)

  Low Density Polyethylene(LDPE) is considered as an important material for the insulation in high voltage dc.The knowledge of conduction current and in LDPE material is quite vital due to the fact that it is related to ...

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