Guo, F.; Aygun, K.; Dale Becker, W.; Talocia, S.G.; Hejase, J.A.; Wong, W.-W.; Zhou, T.; Barnes, H.; Peng, Z.; Pelger, A.; Sahouli, M.; Schutt-Aine, J.; Ling, F.; Griese, E.; Paladhi, P.R.; Sharma, R.; Pham, N.; Winkel, T.-M.; Fledell, E.; Hill, M.J.; Silva, B.; Hu, K.; Aronsson, J.; Liu, C.; Jeong, Y.; Yilmaz, A.E.
(2022-09-03)
The current state of the Packaging Benchmark Suite being developed by the IEEE EPS technical committee on electrical design, modeling, and simulation (TC-EDMS) is reviewed. The history and goals of the effort to establish ...