With on-chip copper interconnects reaching their performance limits at 22 nanometer technology nodes, multi-walled carbon nanotube (MWCNT) interconnects are projected to replace them below this point. A major aspect of ...

At sub-22nm technology nodes, size effects play a prominent role in the performance degradation of Cu interconnects. Several scattering mechanisms contribute to size effects, including surface roughness and grain ...

This paper presents a temperature-aware matrix rational approximation (MRA) technique for the predictive modeling of multiwall carbon nanotube (MWCNT) on-chip interconnect networks. The key feature of the proposed technique ...