Browsing by Author "Naeemi, A."

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Airgap interconnects: Modeling, optimization, and benchmarking for backplane, PCB, and interposer applications

Kumar, V.; Sharma, R.; Uzunlar, E.; Zheng, L.; Bashirullah, R.; Kohl, P.; Bakir, M.S.; Naeemi, A. (2016-11-24)

Frequency and time domain models are developed for backplane (BP), printed circuit board (PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for bumps, vias and connectors, and coupled ...
Design and fabrication of ultra low-loss, high-performance 3D chip-chip air-clad interconnect pathway

Uzunlar, E.; Sharma, R.; Saha, R.; Kumar, V.; Bashirullah, R.; Naeemi, A.; Kohl, P.A. (2016-11-28)

In this study, we are pursuing an ultra low-loss interconnect pathway for 3D chip-chip connectivity, incorporating air-clad planar interconnects, air-clad TSVs, and gradual vertical-horizontal transitions. The motivation ...

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