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Effect of electroplated interlayers on bonding mechanism of cold-sprayed copper on SS316L steel substrate
Singh, S.
;
Singh, H.
(
2021-06-16
)
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Author
Singh, H. (1)
Singh, S. (1)
Subject
Adhesion (1)
Bonding (1)
Cold-spraying (1)
Copper (1)
Electroplating (1)
Nickel (1)
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Date Issued
2021 (1)