Abstract:
In this paper, crosstalk induced effects in a 3-line bus
architecture for global interconnects has been investigated.
The dimensions of global level Copper (Cu) interconnects at
22nm technology node are taken as per ITRS. Crosstalk effects
have been analyzed for both repeated and unrepeated lines in
ternary logic. We have compared crosstalk performance and
signal integrity metrics for Cu interconnects with rough as well
as smooth surfaces considering Carbon Nanotube FET-based
drivers and receivers at 22nm node in ternary logic. Our
simulation results show that worst case crosstalk delay, power
delay product and number of repeaters used in Cu
interconnects with rough surfaces are significantly higher than
smooth interconnects. Also, bandwidth density, eye height and
width are considerably degraded due to roughness.
