Abstract:
In this article, a closed-form matrix rational
approximation (MRA) model is presented for the reliability
assessment of copper–graphene hybrid on-chip interconnect networks. The key feature of this MRA model is its capacity to
predict how the different values of temperature and dielectric
roughness affect the signal integrity performance of the hybrid
interconnect networks. As a result, the proposed MRA model
is well suited for very fast parametric sweeps and worst case
analysis of the hybrid interconnect networks, which has not
been possible using existing closed-form models or even SPICE
simulations. Numerical examples show that the proposed model
is significantly more efficient than conventional models while
exhibiting error less than 5%.
