Abstract:
Thermal management in microelectronics components through micro pin-fins heat sinks is well understood. This work aims to propose an unexplored methodology for fabrication of such MPFs having crosssections in shapes of droplet, aerofoil, piranha and diamond of dimensions as less as 200 mm and height
up to 1200 mm. Density of these pin-fins has been achieved more than 4 pins/mm2 on brass plates. The
methodology is basically a retrieval of mEDM which has been combined with LASER micromachining to
achieve the goal. Research directions for possible improvement in ‘quality of the pin-fins’ and ‘material
removal rate’ have been proposed at the end
