Evaporation is an interfacial phenomenon in which a water molecule breaks the intermolecular hydrogen (H−) bonds and enters the vapor phase. However, a detailed demonstration of the role of interfacial water structure ...

In the present paper, the problem involving the transformation of incident wave energy by floating elastic structure situated at a finite distance from an arbitrary bottom topography is studied. Here, both symmetric and ...

Image inpainting is now-a-days sought after due to its wide variety of applications in the reconstruction of the corrupted image, occlusion removal, reflection removal, etc. Existing image inpainting approaches utilize ...

Building a dependable network of electric vehicle charging stations (EVCSs) requires satisfying the demands and constraints of EV owners, energy grids, and the entities that will own and operate the EVCSs. Thus, determining ...

This paper extends the existing empirical literature by investigating whether the COVID19 crisis has strengthened the dynamic relationships between oil price and exchange rate. We find significant breaks in the relationships ...

Laser beams with high-energy densities are desired for both fundamental research and applied applications. We present a numerical study on the generation of high-energy densities by sidelobe suppression in the ...

Fabrication of complex and filigree magnesium alloy 3D-medical implants is very difficult by conventional processes. The present work examines the feasibility of fabricating arrayed microstructures (protrusions) of magnesium ...

Smart manufacturing is the demand of industry 4.0, in which the mass production of difficult-to-cut materials is of great concern to fulfil the goal of sustainable machining. Presently, the machining of superalloy is of ...

An experimental investigation is carried out to examine the effectiveness of carbon nanotubes (CNT) in minimizing the environmental assisted degradation of glass fiber/epoxy composites (GFRP). To this end, CNT modified ...

A Cu–carbon hybrid interconnect was recently proposed as an alternate interconnect structure for future VLSI applications because of its superior electrical performance over its counterparts. This study focuses on the ...