Abstract:
Spin transfer torque magneto-resistive random-access memory (STT-MRAM) has many advantages, such as scalability, persistence, practically infinite endurance, and fast access speed, that make it a promising and emerging technology for memory. However, this technology has multiple reliability issues, such as read and write reliability, higher write power, and long write latency, etc. At elevated temperatures, these issues exacerbate further. As the temperature increases massively in the latest compute nodes, we need to study and understand the effect of temperature on STT-MRAM memory writes and reliability. In this article, we propose the temperature-aware memory controller (MC) and device architecture techniques specific to STT-MRAM technology, which can improve write reliability, retention reliability, and memory power without sacrificing the performance. Our simulation results show that the proposed techniques cumulatively improve the write bit error rate (BER) on an average by 603 ×, increase retention reliability by 65%, along with 27% power reduction and 5.8% improved system performance over the baseline STT-MRAM-based memory subsystem.
