Abstract:
In this study, we are pursuing an ultra low-loss
interconnect pathway for 3D chip-chip connectivity,
incorporating air-clad planar interconnects, air-clad TSVs, and
gradual vertical-horizontal transitions. The motivation is to
create an air-gap technology that offers the lowest possible
effective k-value and near zero loss tangent minimizing the
dielectric loss. The design and modeling of air-gap
interconnection is presented. The fabrication challenges in airclad
interconnect lines are discussed. A monolithic inverted
air-gap horizontal transmission line structure is proposed as a
means for further decreasing the dielectric loss. Extension of
air-clad TSV technology for optical transmission is briefly
discussed.
