Abstract:
While parallel microchannel based cooling systems (PMCS) have been around for quite a period of time,
employing the same and incorporating them for near–active cooling of microelectronic devices is yet to
be implemented and the implications of the same on thermal mitigation to be understood. The present
article focusses on a specific design of the PMCS such that it can be implemented at ease on the heat
spreader of a modern microprocessor to obtain near-active cooling. Extensive experimental and numerical
studies have been carried out to comprehend the same and three different flow configurations (U, I
and Z) of PMCS have been adopted for the present investigations. Additional to focussing on the thermofluidics
due to flow configuration, nanofluids (as superior heat transfer fluids) have also been
employed to achieve the desired essentials of mitigation of overshoot temperatures and improving uniformity
of cooling. Two modelling methods, Discrete Phase Modelling (DPM) and Effective Property
Modelling (EPM) have been employed for numerical study to model nanofluids as working fluid in micro
flow paths and the DPM predictions have been observed to match accurately with experiments. To quantify
the thermal performance of PMCS, an appropriate Figure of Merit (FoM) has been proposed. From the
FoM It has been perceived that the Z configuration employing nanofluid is the best suitable solutions for
uniform thermal loads to achieve uniform cooling as well as reducing maximum temperature produced
with in the device. The present results are very promising and viable approach for futuristic thermal mitigation
of microprocessor systems.
